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The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Specificaties
Gebonden, 313 blz. | Engels
Springer London | 2011e druk, 2011
ISBN13: 9780857292353
Rubricering
Springer London 2011e druk, 2011 9780857292353
€ 192,99
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Samenvatting

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering.

The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.

Specificaties

ISBN13:9780857292353
Taal:Engels
Bindwijze:gebonden
Aantal pagina's:313
Uitgever:Springer London
Druk:2011

Inhoudsopgave

1. Deformation and Fatigue of Solders.- 2. Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints.- 3. Thermal Fatigue Analysis.- 4. Electrochemical Behavior of Solder Alloys.- 5. Void Formation by Kirkendall Effect in Solder Joints.- 6. Tin Whiskers.- 7. Electromigration in Solder Interconnects.- 8. Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold.- 9. Reliability of Electronic Assemblies under Mechanical Shock Loading.- 10. Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration.- 11. Lead Free and Other Process Effects on Conductive Anodic Filamentation (CAF) Resistance of Glass Reinforced Epoxy Laminates.- 12. PCB Delamination.- 13. Excessive Warpage of Large Packages during Reflow Soldering.- 14. Popcorn Cracking.- 15. Thermal Capability of Components.
€ 192,99
Levertijd ongeveer 9 werkdagen
Gratis verzonden

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        The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects