Springer Handbook of Experimental Solid Mechanics
Samenvatting
The Springer Handbook of Experimental Solid Mechanics documents both the traditional techniques as well as the new methods for experimental studies of materials, components, and structures. The emergence of new materials and new disciplines, together with the escalating use of on- and off-line computers for rapid data processing and the combined use of experimental and numerical techniques have greatly expanded the capabilities of experimental mechanics. New exciting topics are included on biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, and atomic force microscopy in experimental solid mechanics.
Presenting complete instructions to various areas of experimental solid mechanics, guidance to detailed expositions in important references, and a description of state-of-the-art applications in important technical areas, this thoroughly revised and updated edition is an excellent reference to a widespread academic, industrial, and professional engineering audience.
Specificaties
Inhoudsopgave
<P><STRONG>Part B Contact Methods</STRONG> Chap. 12 Electrical Resistance Strain Gages.- Chap. 13 Extensometers.- Chap. 14 Fiber Strain Gages.- Chap. 15 Residual Stress Measurement.- Chap. 16 Nanoindentation.- Chap. 17 Atomic Force Microscopy.</P>
<P><STRONG>Part C Noncontact Methods</STRONG> Chap. 18 Basics of Optics.- Chap. 19 Image Analysis and Processing.- Chap. 20 Digital Image Correlation.- Chap. 21 Geometric Moiré.- Chap. 22 Moiré Interferometry.- Chap. 23 Speckle Methods.- Chap. 24 Holography.- Chap. 25 Photoelasticity.- Chap. 26 Thermoelastic Stress Analysis.- Chap. 27 Photoacoustic Characterization of Materials.- Chap. 28 X-Ray Stress Analysis.</P>
<P><STRONG>Part D Applications</STRONG> Chap 29 Optical Methods.- Chap. 30 Mechanical Testing at the Micro/Nano Scale.- Chap. 31 Biological Tissue Testing.- Chap. 32 Biomedical Devices and Biologically Inspired Materials.- Chap. 33 High Strain Rate and Impact Testing.- Chap. 34 Delamination Mechanics.- Chap. 35 Structural Testing Applications.- Chap. 36 Electronic Packaging.</P>