John W. Balde
Springer US
2003e druk, 2003
9780792376767
Foldable Flex and Thinned Silicon Multichip Packaging Technology
Specificaties
Gebonden, 347 blz.
|
Engels
Springer US |
2003e druk, 2003
ISBN13: 9780792376767
Rubricering
Onderdeel van serie
Emerging Technology in Advanced Packaging
Levertijd ongeveer 9 werkdagen
Gratis verzonden
Samenvatting
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
Specificaties
ISBN13:9780792376767
Taal:Engels
Bindwijze:gebonden
Aantal pagina's:347
Uitgever:Springer US
Druk:2003
Inhoudsopgave
1. 3-D Assemblies of Stacked Chips and other Thin Packages.- 2. Multi-Chip Carriers in a System-on-a-Chip World.- 3. Packaging Technologies for Flexible Systems.- 4. Low Profile and Flexible Electronic Assemblies Using Ultra-Thin Silicon - The European Flex-Si Project.- 5. Thin Chips for Flexible and 3-D Integrated Electronic Systems.- 6. Flexible Microarray Interconnection Techniques Applied to Biomedical Microdevices.- 7. Folded Flex and other Structures for System-in-a Package.- 8. Valtronic CSP3D Technology.- 9. 3-D Packaging Technologies: Are Flex based Solutions the Answer?.- 10. Availability of High Density Interconnect Flexible Circuits.- 11. Recent Advances in Flexible Circuit Technology Using Liquid Crystal Polymer Substrates.- 12. Flex and the Interconnected Mesh Power System (IMPS).- 13. Thermal Management and Control of Electromagnetic Emissions.- Conclusions.- Authors’ Biographies.